Cryconnect Cryconnection- Reaching into the cold
In This Issue: May 2007 
•   Cryogenic Market Insight
•   New 'nanominiature' interconnections deliver up to 90% in weight savings
•   Where to meet us in 2007
Cryogenic Market Insight
The architecture of micro/nano electromechanical systems is growing rapidly and Tekdata's Cryoconnect and Microconnect interconnection technology is keeping pace with the performance expectations.

Developing interconnection solutions involving nano connectors and wire alloy conductors as small as .061mm is highly challenging. Cryogenic applications are a fast developing market sector which includes:

… Preservation of biological material and food (food processing).
… Densification (liquefaction & separation)
… Quantum effects (fluids and superconductivity)
- Low dissipation (superconductivity)
- High-precision metrology (atomic parameters)
- Action over a distance (fast response)
… Low thermal noise
- Electromagnetic
- Electronic
… Low vapor pressures (cryopumping)
… Property changes (permanent and temporary)
… Tissue ablation (cryosurgery)

These combined market sectors are worth an estimated $10 billion and are growing at an astonishing rate. Contact us today to see how we can help you develop interconnection solutions that will meet your goals and objectives.

Click here to find out how cryoconnect can help you reach into the cold

New 'nanominiature' interconnections deliver up to 90% in weight savings
Tekdata recently announced its new 'nanominiature' cable assemblies incorporating the latest advances in nanotechnology and environmental tolerance.

Weight savings of up to 90% can be delivered in comparison to traditional assemblies as a result of these advances. These complex assemblies can be in a wide range of connectors, both micro-miniature and 'nanominiature' from 9 ways to 100 ways.

These cable assemblies - whose origins stem from innovative, space-science developments conducted by Tekdata's Cryoconnect division - feature high density, low mass, electronic packaging for aerospace, defence and space applications.

Read more about these new interconnections...

68 way cable
Where to meet us in 2007
June 21-23 2007
International Workshop on Low Temperature Electronics
Noordwijk, The Netherlands
More info: www.congrex.nl/06c01

July 11-13, 2007
SPACE CRYOGENICS WORKSHOP, Div. of CSA
Co-chairs: Sally Little and Leon J. Hastings.
NASA Marshall Space Flight Center
More info: www.spacecryogenicsworkshop.org

July 22-27, 2007
LTD12. INTERNATIONAL WORKSHOP ON LOW TEMPERATURE DETECTORS.
The 12th International Workshop on Low Temperature Detectors (LTD-12) will be held in the historical premises of CNAM (Conservatoire National des Arts et MÈtiers).
Paris, France
More info: www.ltd12.org

November 27-30, 2007
3rd European Space Cryogenics Workshop
Sponsored by European Space Agency - ESA/ESTEC
The space cryogenics workshop will cover topics related to space developments and on-going and future cryogenic space missions. A dedicated session will cover topics related to cryogenic testing facility for space applications. Participants will have the opportunity to share their technical expertise and experiences through formal presentations and informal discussions.
Noordwijk, The Netherlands
More info: www.congrex.nl/07c03

Follow this link to see our complete calendar of events

Congress
Tekdata Interconnect Systems, Westport House, Federation Road, Burslem, Stoke-on-Trent, Staffordshire. ST6 4HY, UK Tel: +44 (0) 1296 613 786, Fax: +44 (0) 1296 614 247

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